Bigme unveils HiBreak Dual 3 E Ink smartphone with magnetic LCD
Bigme unveiled the HiBreak Dual 3, a dual-screen Android smartphone featuring a front color E Ink display and a detachable magnetic LCD module, on August 27, 2026. According to company officials, the device targets users seeking eye-friendly reading and productivity on the E Ink screen with the option to switch to a conventional LCD for media and gaming.
The HiBreak Dual 3 is equipped with a 6.13-inch color E Ink display on the front, featuring approximately 300 pixels per inch (PPI) in grayscale and 150 PPI in color, according to Notebookcheck and other tech reports. This E Ink panel supports an 85-hertz refresh rate, an unusually high figure for e-ink technology, aimed at reducing ghosting and improving responsiveness, sources said. The rear of the phone hosts a detachable magnetic LCD module that attaches via magnets and metal pins, which also supply power and enable charging of the module directly from the phone, according to coverage by IT media and Notebookcheck. Unlike its predecessor, the HiBreak Dual 2, which had a fixed rear LCD, the Dual 3’s secondary screen can be removed, allowing users to operate the device solely with the E Ink display or attach the LCD module for more conventional smartphone use.
The HiBreak Dual 3’s 6.13-inch color E Ink display features approximately 300 pixels per inch (PPI) in grayscale and 150 PPI in color, and supports an 85-hertz refresh rate, an unusually high figure for e-ink technology, according to Notebookcheck.
Bigme has positioned the HiBreak Dual 3 as a 5G-capable mid-to-high-end device powered by a MediaTek Dimensity 8300 octa-core processor, sources confirmed. The phone runs Android 16, described in Chinese tech media as an “open system” that supports standard Android apps and customization. The device supports dual-SIM dual-standby functionality and full 5G network connectivity, signaling an intent to appeal to mainstream smartphone users rather than only niche e-ink enthusiasts, according to reports from iXBT Live and Notebookcheck.
The HiBreak Dual 3 is available in two configurations: one with 12 gigabytes of RAM and 256 GB of storage, and a higher-end model with 16 GB of RAM and 512 GB of storage, according to Chinese media sources. Both configurations support the detachable LCD module and dual-SIM 5G connectivity. There has been no official confirmation regarding microSD card expansion, contrasting with earlier entry-level HiBreak models that included such support. Pricing details have not been disclosed, with Bigme and media outlets only indicating the phone is “coming soon,” as of late August 2026.
The phone supports a proprietary stylus with 4,096 levels of pressure sensitivity, enabling note-taking, annotation, and drawing directly on the E Ink screen, according to iXBT Live. This feature aligns with Bigme’s broader HiBreak ecosystem, which emphasizes eye-friendly reading and document work. The detachable LCD module is described as an accessory-like component that allows users to reduce bulk and weight when the secondary screen is not needed, reports said. The magnetic connection, combining magnets and metallic pins, facilitates both power delivery and likely data transmission, meaning the rear LCD operates only when physically attached to the phone.
Design-wise, the HiBreak Dual 3 is an Android monoblock device with an E Ink matrix on the front that transforms into a dual-screen smartphone when the magnetic IPS/LCD module is attached at the rear. The secondary screen is intended for short-form video, gaming, and visually rich applications, while the main E Ink display serves reading, messaging, and other tasks that benefit from reduced eye strain, according to multiple tech reports from Russia, Germany, and China. The rear LCD builds on the concept introduced by the first HiBreak Dual, which had a fixed 1.85-inch circular LCD with a 360×360 resolution, but now features a removable magnetic mount with charging capabilities.
Bigme unveiled the HiBreak Dual 3 on August 27, 2026, but has not announced a firm release date, according to iXBT Live and official company statements relayed through IT media. The company has indicated a “soon-to-start rollout” without specifying calendar details. The HiBreak product line began with earlier entry-level E Ink phones featuring a 5.84-inch display, MediaTek MTK6765 processor, Android 11, and 4G connectivity, which were sold in limited pre-sale batches starting May 31, 2024. The original HiBreak Dual introduced the fixed rear circular LCD secondary screen, establishing the design language that the Dual 3 now iterates on with higher-end silicon, Android 16, and the detachable magnetic LCD module.
The HiBreak Dual 3’s combination of a high-refresh-rate E Ink display, detachable rear LCD, and mid-range 5G chipset reflects Bigme’s attempt to reduce traditional performance compromises associated with e-ink smartphones, according to Notebookcheck and iXBT Live. The device targets users sensitive to eye strain, heavy readers, and enthusiasts interested in experimental dual-display hardware, positioning it as a niche but growing market offering.
